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| PROFET(R) BTS 432 D2 Smart Highside Power Switch Features * * * * * * * * * * * * Load dump and reverse battery protection1) Clamp of negative voltage at output Short-circuit protection Current limitation Thermal shutdown Diagnostic feedback Open load detection in ON-state CMOS compatible input Electrostatic discharge (ESD) protection Loss of ground and loss of Vbb protection2) Overvoltage protection Undervoltage and overvoltage shutdown with autorestart and hysteresis Product Summary VLoad dump 80 Vbb-VOUT Avalanche Clamp 58 Vbb (operation) 4.5 ... 42 Vbb (reverse) -32 RON 38 IL(SCp) 44 IL(SCr) 35 IL(ISO) 11 V V V V m A A A Application 5 5 5 * C compatible power switch with diagnostic feedback for 12 V and 24 V DC grounded loads * All types of resistive, inductive and capacitve loads * Replaces electromechanical relays and discrete circuits 1 Straight leads 1 SMD Standard General Description N channel vertical power FET with charge pump, ground referenced CMOS compatible input and diagnostic feedback, integrated in Smart SIPMOS(R) chip on chip technology. Fully protected by embedded protection functions. R bb + V bb 3 Voltag e source V Logic Voltag e sensor Overvoltag eprotectio n Charge pump Level shifter Rectifie r Curren t limit Gate protectio n OUT 2 IN Limit for unclampe d ind. loads Open load detectio n Short circuit detectio n Temperatur e sensor 5 Load ESD Logic 4 ST GND 1 Signal GND PROF ET (R) Load GND 1) 2) No external components required, reverse load current limited by connected load. Additional external diode required for charged inductive loads Infineon Technologies AG Page 1 of 14 1999-03-22 BTS 432 D2 Pin 1 2 3 4 5 Symbol GND IN Vbb ST OUT (Load, L) I + S O Function Logic ground Input, activates the power switch in case of logical high signal Positive power supply voltage, the tab is shorted to this pin Diagnostic feedback, low on failure Output to the load Maximum Ratings at Tj = 25 C unless otherwise specified Parameter Supply voltage (overvoltage protection see page 3) Load dump protection VLoadDump = UA + Vs, UA = 13.5 V RI= 2 , RL= 1.1 , td= 200 ms, IN= low or high Load current (Short-circuit current, see page 4) Operating temperature range Storage temperature range Power dissipation (DC) Inductive load switch-off energy dissipation, single pulse Tj=150 C: Electrostatic discharge capability (ESD) (Human Body Model) Input voltage (DC) Current through input pin (DC) Current through status pin (DC) see internal circuit diagrams page 6... Symbol Vbb Vs 3) IL Tj Tstg Ptot EAS VESD VIN IIN IST Values 63 66.5 self-limited -40 ...+150 -55 ...+150 125 1.7 2.0 -0.5 ... +6 5.0 5.0 1 75 tbd Unit V V A C W J kV V mA Thermal resistance chip - case: RthJC junction - ambient (free air): RthJA SMD version, device on pcb4): K/W 3) 4) VS is setup without DUT connected to the generator per ISO 7637-1 and DIN 40839 Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm2 (one layer, 70m thick) copper area for Vbb connection. PCB is vertical without blown air. Infineon Technologies AG Page 2 1999-Mar.-22 BTS 432 D2 Electrical Characteristics Parameter and Conditions at Tj = 25 C, Vbb = 12 V unless otherwise specified Symbol Values min typ max Unit Load Switching Capabilities and Characteristics On-state resistance (pin 3 to 5) IL = 2 A Tj=25 C: RON Tj=150 C: Nominal load current (pin 3 to 5) ISO Proposal: VON = 0.5 V, TC = 85 C Output current (pin 5) while GND disconnected or GND pulled up, V IN = 0, see diagram page 7, Tj =-40...+150C Turn-on time to 90% VOUT: Turn-off time to 10% VOUT: RL = 12 , Tj =-40...+150C Slew rate on 10 to 30% VOUT, RL = 12 , Tj =-40...+150C Slew rate off 70 to 40% VOUT, RL = 12 , Tj =-40...+150C Operating Parameters Operating voltage 5) Tj =-40...+150C: Undervoltage shutdown Tj =-40...+150C: Undervoltage restart Tj =-40...+150C: Undervoltage restart of charge pump see diagram page 12 Tj =-40...+150C: Undervoltage hysteresis Vbb(under) = Vbb(u rst) - Vbb(under) Overvoltage shutdown Tj =-40...+150C: Overvoltage restart Tj =-40...+150C: Overvoltage hysteresis Tj =-40...+150C: Overvoltage protection6) Tj =-40C: Ibb=40 mA Tj =25...+150C: Standby current (pin 3) Tj=-40...+25C: VIN =0, IST=0, Tj=150C: Leakage output current (included in Ibb(off)) VIN=0 Operating current (Pin 1)7), VIN =5 V 5) 6) -9 -- 30 55 11 -- 38 70 -1 m A mA s IL(ISO) IL(GNDhigh) ton toff dV /dton -dV/dtoff 50 10 0.4 1 160 ---- 300 80 2.5 5 V/s V/s Vbb(on) Vbb(under) Vbb(u rst) Vbb(ucp) Vbb(under) Vbb(over) Vbb(o rst) Vbb(over) Vbb(AZ) Ibb(off) IL(off) IGND 4.5 2.4 ---42 42 -60 63 ----- ---6.5 0.2 --0.2 -67 12 18 6 1.1 42 4.5 4.5 7.5 -52 ---25 60 --- V V V V V V V V V A A mA At supply voltage increase up to Vbb= 6.5 V typ without charge pump, VOUT Vbb - 2 V see also VON(CL) in table of protection functions and circuit diagram page 7. Meassured without load. Infineon Technologies AG Page 3 1999-Mar.-22 BTS 432 D2 Protection Functions Initial peak short circuit current limit (pin 3 to 5)8), IL(SCp) ( max 400 s if V ON > V ON(SC) ) Tj =-40C: Tj =25C: Tj =+150C: Repetitive short circuit current limit IL(SCr) Tj = Tjt (see timing diagrams, page 10) Short circuit shutdown delay after input pos. slope VON > VON(SC), Tj =-40..+150C: td(SC) min value valid only, if input "low" time exceeds 30 s --24 22 80 -44 -35 -- 74 ---400 A A s V V C K J Output clamp (inductive load switch off) at V OUT = V bb - V ON(CL), IL= 30 mA Short circuit shutdown detection voltage (pin 3 to 5) Thermal overload trip temperature Thermal hysteresis Inductive load switch-off energy dissipation9), Tj Start = 150 C, single pulse Vbb = 12 V: Vbb = 24 V: Reverse battery (pin 3 to 1) 10) Integrated resistor in V bb line Diagnostic Characteristics Open load detection current (on-condition) VON(CL) VON(SC) Tjt Tjt EAS ELoad12 ELoad24 -Vbb Rbb --150 --- 58 8.3 -10 -- ----1.7 1.3 1.0 32 -- --- -120 V Tj=-40 C: IL (OL) Tj=25..150C: 2 2 --- 900 750 mA 7) 8) 9) Add IST , if IST > 0, add IIN, if VIN>5.5 V Short circuit current limit for max. duration of 400 s, prior to shutdown (see td(SC) page 4) While demagnetizing load inductance, dissipated energy in PROFET is EAS= VON(CL) * iL (t) dt, approx. VON(CL) 2 EAS= 1/2 * L * IL * ( ), see diagram page 8 VON(CL) - Vbb 10) Reverse load current (through intrinsic drain-source diode) is normally limited by the connected load. Reverse current IGND of 0.3 A at Vbb= -32 V through the logic heats up the device. Time allowed under these condition is dependent on the size of the heatsink. Reverse IGND can be reduced by an additional external GND-resistor (150 ). Input and Status currents have to be limited (see max. ratings page 2 and circuit page 7). Infineon Technologies AG Page 4 1999-Mar.-22 BTS 432 D2 Input and Status Feedback11) Input turn-on threshold voltage Tj =-40..+150C: Input turn-off threshold voltage Tj =-40..+150C: Input threshold hysteresis Off state input current (pin 2) On state input current (pin 2) VIN(T+) VIN(T-) VIN(T) VIN = 0.4 V: IIN(off) VIN = 3.5 V: IIN(on) td(ST SC) td(ST) 1.5 1.0 -1 10 80 350 --0.5 -25 200 -- 2.4 --30 50 400 1600 V V V A A s s Status invalid after positive input slope (short circuit) Tj=-40 ... +150C: Status invalid after positive input slope (open load) Tj=-40 ... +150C: Status output (CMOS) Tj =-40...+150C, IST= - 50 A: Tj =-40...+150C, IST = +1.6 mA: Max. status current for current source (out): valid status output, current sink (in) : Tj =-40...+150C VST(high)12) VST(low) -IST +IST13) 4.4 ---- 5.1 ---- 6.5 0.4 0.25 1.6 V mA 11) If a ground resistor R GND is used, add the voltage drop across this resistor. 12) V Vbb during undervoltage shutdown St high 13) No current sink capability during undervoltage shutdown Infineon Technologies AG Page 5 1999-Mar.-22 BTS 432 D2 Truth Table Inputlevel Normal operation Open load Short circuit to GND Short circuit to Vbb Overtemperature Undervoltage Overvoltage L = "Low" Level H = "High" Level L H L H L H L H L H L H L H Output level L H 14) Status 432 D2 H H H L H L H H (L15)) L L L16) L16) L L 432 E2/F2 H H H L H L H H (L15)) L L H H H H 432 I2 H H L H H L L H L L L16) L16) L L H L L H H L L L L L L Terms Ibb 3 I IN IN 2 I ST V V bb R IN VST 4 ST GND 1 GND IGND VOUT PROFET OUT 5 Vbb IL VON Status output VLogic ST GND ESDZD Zener diode: 6.1 V typ., max 5 mA, VLogic 5 V typ, ESD zener diodes are not designed for continuous current Short Circuit detection Input circuit (ESD protection) R IN I Fault Condition: VON > 8.3 V typ.; IN high + V bb ESDZDI1 ZDI2 GND I I Short circuit detection V ON OUT ZDI1 6.1 V typ., ESD zener diodes are not designed for continuous current Logic unit 14) Power Transistor off, high impedance 15) Low resistance short V to output may be detected by no-load-detection bb 16) No current sink capability during undervoltage shutdown Infineon Technologies AG Page 6 1999-Mar.-22 BTS 432 D2 Inductive and overvoltage output clamp + V bb V Z V ON GND disconnect 3 IN 2 PROFET OUT 5 Vbb OUT GND 4 V bb V IN V ST ST GND 1 VGND VON clamped to 58 V typ. Overvolt. and reverse batt. protection + V bb Any kind of load. In case of Input=high is VOUT VIN - VIN(T+) . Due to VGND >0, no VST = low signal available. GND disconnect with GND pull up 3 R IN VZ IN R bb Logic V 2 OUT IN Vbb PROFET OUT R ST ST GND 5 PROFET 4 ST GND 1 RGND Signal GND Rbb = 120 typ., VZ +Rbb *40 mA = 67 V typ., add RGND, RIN , RST for extended protection V V bb V IN ST V GND Open-load detection ON-state diagnostic condition: VON < RON * IL(OL); IN high + Vbb Any kind of load. If VGND > VIN - VIN(T+) device stays off Due to VGND >0, no VST = low signal available. Vbb disconnect with charged inductive load 3 high 2 IN Vbb PROFET 4 ST GND 1 V OUT ON VON 5 OUT Logic unit Open load detection bb Infineon Technologies AG Page 7 1999-Mar.-22 BTS 432 D2 3 high 2 IN Vbb PROFET 4 ST GND 1 OUT Inductive Load switch-off energy dissipation E bb E AS 5 IN V bb PROFET OUT E Load = V bb ST GND EL ER Energy dissipated in PROFET EAS = Ebb + EL - ER. 2 ELoad < EL, EL = 1/2 * L * I L Infineon Technologies AG Page 8 1999-Mar.-22 BTS 432 D2 Options Overview all versions: High-side switch, Input protection, ESD protection, load dump and reverse battery protection , protection against loss of ground Type Logic version BTS 432D2 432E2 432F2 432I2 D E F I Overtemperature protection Tj >150 C, latch function17)18) Tj >150 C, with auto-restart on cooling Short-circuit to GND protection switches off when VON>8.3 V typ. 17) (when first turned on after approx. 200 s) X X X X X X X X Open load detection in OFF-state with sensing current 30 A typ. in ON-state with sensing voltage drop across power transistor X X X X X X X X X X X X Undervoltage shutdown with auto restart Overvoltage shutdown with auto restart Status feedback for overtemperature short circuit to GND short to Vbb open load undervoltage overvoltage X X -19) X X X X X -19) X - X X -19) X - X X X X X X Status output type CMOS Open drain X X X X Output negative voltage transient limit (fast inductive load switch off) to Vbb - VON(CL) X X X X Load current limit high level (can handle loads with high inrush currents) medium level low level (better protection of application) X X X X 17) Latch except when V -V bb OUT < VON(SC) after shutdown. In most cases VOUT = 0 V after shutdown (VOUT 0 V only if forced externally). So the device remains latched unless Vbb < VON(SC) (see page 4). No latch between turn on and td(SC). 18) With latch function. Reseted by a) Input low, b) Undervoltage, c) Overvoltage 19) Low resistance short V to output may be detected by no-load-detection bb Infineon Technologies AG Page 9 1999-Mar.-22 BTS 432 D2 Timing diagrams Figure 1a: Vbb turn on: Figure 2b: Switching an inductive load IN IN t d(bb IN) V bb ST *) td(ST) V OUT V A OUT ST CMOS t A in case of too early VIN=high the device may not turn on (curve A) td(bb IN) approx. 150 s I L IL(OL) t *) if the time constant of load is too large, open-load-status may occur Figure 2a: Switching a lamp, Figure 3a: Turn on into short circuit, IN IN ST ST V OUT V OUT td(SC) I L I L t t td(SC) approx. 200s if Vbb - VOUT > 8.3 V typ. Infineon Technologies AG Page 10 1999-Mar.-22 BTS 432 D2 Figure 3b: Turn on into overload, Figure 4a: Overtemperature, Reset if (IN=low) and (Tj IN IL I L(SCp) I L(SCr) ST V OUT ST t T J t Heating up may require several milliseconds , Vbb - VOUT < 8.3 V typ. *) ST goes high , when VIN=low and Tj IN IN ST ST V OUT V OUT t d(ST) IL **) t I L open t **) current peak approx. 20 s Infineon Technologies AG Page 11 1999-Mar.-22 BTS 432 D2 Figure 5b: Open load: detection in ON-state, open load occurs in on-state Figure 6b: Undervoltage restart of charge pump VON [V] V on IN VON(CL) off t d(ST OL1) ST t d(OL ST2) V OUT V off bb(over) V I L V V bb(u rst) bb(o rst) normal open normal V t bb(under) bb(u cp) on V bb Vbb [V] td(ST OL1) = tbd s typ., td(ST OL2) = tbd s typ charge pump starts at Vbb(ucp) =6.5 V typ. Figure 7a: Overvoltage: Figure 6a: Undervoltage: IN IN Vbb Vbb V Vbb(u cp) V bb(u rst) V OUT V ON(CL) Vbb(over) V bb(o rst) bb(under) V OUT ST ST CMOS t t Infineon Technologies AG Page 12 1999-Mar.-22 BTS 432 D2 Package and Ordering Code All dimensions in mm Standard TO-220AB/5 BTS 432 D2 Ordering code Q67060-S6201-A2 TO-220AB/5, Option E3043 Ordering code BTS 432 D2 E3043 Q67060-S6201-A4 SMD TO-220AB/5, Opt. E3062 Ordering code BTS432D2 E3062A T&R: Q67060-S6201-A5 Infineon Technologies AG Page 13 1999-Mar.-22 BTS 432 D2 Published by Infineon Technologies AG, Balanstrae 73, D81541 Munchen (c) Infineon Technologies AG 2002. All Rights Reserved Attention please! As far as patents or other rights of third parties are concerned, liability is only assumed for components, not for applications, processes and circuits implemented within components or assemblies. The information describes a type of component and shall not be considered as warranted characteristics. Terms of delivery and rights to change design reserved. For questions on technology, delivery and prices please contact the Semiconductor Group Offices in Germany or the Infineon Companies and Representatives worldwide (see address list). Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Office. Infineon Technologies AG is an approved CECC manufacturer. Packing: Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorised for such purpose! Critical components 20) of the Infineon Technologies AG, may only be used in life supporting devices or systems 21) with the express written approval of Infineon Technologies AG. 20) A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 21) Life support devices or systems are intended (a) to be implanted in the human body or (b) support and/or maintain and sustain and/or protect human life. If they fail, it is reasonably to assume that the health of the user or other persons may be endangered. Infineon Technologies AG Page 14 1999-Mar.-22 |
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